Computing Power Heat Dissipation Structural Components Market Size Report 2025
On Oct 13, the latest report "Global Computing Power Heat Dissipation Structural Components Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031" from Global Info Research provides a detailed and comprehensive analysis of the global Computing Power Heat Dissipation Structural Components market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.
Get Report Sample with Industry Insights https://www.globalinforesearch.com/reports/2945275/computing-power-heat-dissipation-structural-components
According to our (Global Info Research) latest study, the global Computing Power Heat Dissipation Structural Components market size was valued at US$ 750 million in 2024 and is forecast to a readjusted size of USD 2500 million by 2031 with a CAGR of 20.1% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
In 2024, the price of computing power heat dissipation structural components was ,049 per thousand units, with total sales reaching 180 million units.
Computing Power Heat Dissipation Structural Components are core metal structural parts that provide mechanical support and thermal conduction pathways for the cooling systems of high-performance computing devices (e.g., AI servers, GPU accelerators, data center switches). These components encompass precision die-cast/CNC-machined liquid cold plate substrates, high-thermal-conductivity fin array brackets, high-pressure-resistant sealed housings, and customized cooling frames for heterogeneous computing chips. They must meet stringent requirements for high heat flux density, multi-dimensional thermal topology, and long-term corrosion resistance. Their materials (e.g., copper alloys, aluminum silicon carbide) and manufacturing processes (e.g., ultra-thin channel milling, vacuum brazing) directly determine the cooling efficiency and reliability of computing equipment, serving as the critical physical interface between heat-generating units and active cooling components (e.g., liquid cooling pumps, immersion cooling systems).
This report is a detailed and comprehensive analysis for global Computing Power Heat Dissipation Structural Components market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Computing Power Heat Dissipation Structural Components market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: Air-cooled、 Liquid-cooled
Market segment by Application: Server、 Consumer Electronics、 Telecommunication Equipment、 Other
Major players covered: Delta Electronics, Inc.、 NIDEC CORPORATION、 Dongguan Manko Hardware Products Co., Ltd.、 Auras Technology Co., Ltd.、 Jiangsu Gian Technology Co., Ltd.、 Shenzhen FRD Technology Co., Ltd.、 Casetek Precision Industrial Co., Ltd.、 Beijing Zhongshi Weiye Technology Co., Ltd.、 Guangdong Lingyi Intelligent Manufacturing Co., Ltd.、 Taico Electronic (Zhuhai) Co., Ltd.、 Forcecon Technology Co., Ltd.、 Suzhou Tianmai Thermal Technology Co., Ltd.、 QuanJing Technology Co., Ltd.、 Shenzhen Winboth Thermal Technology Co., Ltd.
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Computing Power Heat Dissipation Structural Components product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Computing Power Heat Dissipation Structural Components, with price, sales quantity, revenue, and global market share of Computing Power Heat Dissipation Structural Components from 2020 to 2025.
Chapter 3, the Computing Power Heat Dissipation Structural Components competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Computing Power Heat Dissipation Structural Components breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment Computing Power Heat Dissipation Structural Components the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the Computing Power Heat Dissipation Structural Components sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Computing Power Heat Dissipation Structural Components market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Computing Power Heat Dissipation Structural Components.
Chapter 14 and 15, to describe Computing Power Heat Dissipation Structural Components sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Computing Power Heat Dissipation Structural Components
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
Contact Us:
Global Info Research
Web: https://www.globalinforesearch.com
Email: report@globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
Get Report Sample with Industry Insights https://www.globalinforesearch.com/reports/2945275/computing-power-heat-dissipation-structural-components
According to our (Global Info Research) latest study, the global Computing Power Heat Dissipation Structural Components market size was valued at US$ 750 million in 2024 and is forecast to a readjusted size of USD 2500 million by 2031 with a CAGR of 20.1% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
In 2024, the price of computing power heat dissipation structural components was ,049 per thousand units, with total sales reaching 180 million units.
Computing Power Heat Dissipation Structural Components are core metal structural parts that provide mechanical support and thermal conduction pathways for the cooling systems of high-performance computing devices (e.g., AI servers, GPU accelerators, data center switches). These components encompass precision die-cast/CNC-machined liquid cold plate substrates, high-thermal-conductivity fin array brackets, high-pressure-resistant sealed housings, and customized cooling frames for heterogeneous computing chips. They must meet stringent requirements for high heat flux density, multi-dimensional thermal topology, and long-term corrosion resistance. Their materials (e.g., copper alloys, aluminum silicon carbide) and manufacturing processes (e.g., ultra-thin channel milling, vacuum brazing) directly determine the cooling efficiency and reliability of computing equipment, serving as the critical physical interface between heat-generating units and active cooling components (e.g., liquid cooling pumps, immersion cooling systems).
This report is a detailed and comprehensive analysis for global Computing Power Heat Dissipation Structural Components market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Computing Power Heat Dissipation Structural Components market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: Air-cooled、 Liquid-cooled
Market segment by Application: Server、 Consumer Electronics、 Telecommunication Equipment、 Other
Major players covered: Delta Electronics, Inc.、 NIDEC CORPORATION、 Dongguan Manko Hardware Products Co., Ltd.、 Auras Technology Co., Ltd.、 Jiangsu Gian Technology Co., Ltd.、 Shenzhen FRD Technology Co., Ltd.、 Casetek Precision Industrial Co., Ltd.、 Beijing Zhongshi Weiye Technology Co., Ltd.、 Guangdong Lingyi Intelligent Manufacturing Co., Ltd.、 Taico Electronic (Zhuhai) Co., Ltd.、 Forcecon Technology Co., Ltd.、 Suzhou Tianmai Thermal Technology Co., Ltd.、 QuanJing Technology Co., Ltd.、 Shenzhen Winboth Thermal Technology Co., Ltd.
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Computing Power Heat Dissipation Structural Components product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Computing Power Heat Dissipation Structural Components, with price, sales quantity, revenue, and global market share of Computing Power Heat Dissipation Structural Components from 2020 to 2025.
Chapter 3, the Computing Power Heat Dissipation Structural Components competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Computing Power Heat Dissipation Structural Components breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment Computing Power Heat Dissipation Structural Components the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the Computing Power Heat Dissipation Structural Components sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Computing Power Heat Dissipation Structural Components market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Computing Power Heat Dissipation Structural Components.
Chapter 14 and 15, to describe Computing Power Heat Dissipation Structural Components sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Computing Power Heat Dissipation Structural Components
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
Contact Us:
Global Info Research
Web: https://www.globalinforesearch.com
Email: report@globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
